核心期刊网首页> 外军国防科技报告> 数字空间系统

Two-dimensional material based layer transfer of thin film devices;


The semiconductor industry has mainly centered around silicon-based technology due to its associated cost advantage stemming from the abundance of the element and well-established fabrication infrastructures. However, there exists a plethora of compound semiconductors that offer unique electronic properties that can enable high performance devices superior to silicon for a wide range of device applications. Unfortunately, compound semiconductors industries have seen limited adoption in industries except in occasions where silicon-based technology cannot be used. This is mainly due to the rarity and high production costs associated with alternative semiconductor wafers. There have been many proposals that attempt to reduce the cost of production of these compound semiconductors by offering reusable wafers. In this scheme, the wafer is used as a platform to fabricate devices, the device layer is subsequently exfoliated from the wafer via a layer transfer allowing for the wafer to be re-u......

【关 键 词】: Two-dimensional material based layer transfer of thin film devices
【网站名称】: 数字空间系统
【期刊论文数据库】: [DBS_Articles_01]
【期刊论文编号】: 103,836,297
【摘要长度】: 1,000
【栏目名称】: 所有文件
【上篇论文】: 外军国防科技报告 - Supernumerary robotic fingers for single-handed grasping and manipulation assistance;
【下篇论文】: 外军国防科技报告 - Silicon bottom subcell fabrication, loss analysis and shunt identification for two-terminal multijunction solar cells;

【论文下载】: 免费获取 该期刊&论文全文内容