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Flip Chip Technology Vendor Overview


Advancements in the packaging of semiconductor devices traditionally use wire bonds to provide the interconnect from device to substrate or to other active devices. Flip chip offers advantages over traditional interconnect schemes. A smaller overall footprint can be realized, better thermal heat tra......

【作者名称】: Mark S. Hauhe
【作者单位】: RF Tech Director, Advanced Concepts & Technology 2000 El Segundo Blvd, El Segundo, CA 90245 Bldg E01 M/SA135 Raytheon 310-647-0322
【关 键 词】: active array, flip chip, MMIC
【会议名称】: Annual International Conference on Compound Semiconductor MANufacturing TECHnology(CS MANTECH); 20050411-14; New Orleans,LA(US)
【期刊论文数据库】: [DBS_Articles_02]
【期刊论文编号】: 112,460,572
【摘要长度】: 421
【会议地点】: New Orleans,LA(US)
【会议组织】: RF Tech Director, Advanced Concepts & Technology 2000 El Segundo Blvd, El Segundo, CA 90245 Bldg E01 M/SA135 Raytheon 310-647-0322
【会议时间】: 2005
【上篇论文】: 外文会议 - Reduction of Edge Particles on pHEMT Wafers grown by Production Molecular Beam Epitaxy
【下篇论文】: 外文会议 - Resistance and Inductance of Through-Wafer Vias: Measurement, Modeling, and Scaling

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